HPE DL 380 G7 E5620 PROCESSOR – Intel Xeon E5620 2.40GHz

HPE DL 380 G7 E5620 PROCESSOR – Intel Xeon E5620 2.40GHz
Key Features
Brand: HPE
Specifications:
Category Proliant Processor
Sub-Category Intel Xeon
Generation G7
Part Number 587476-B21
Products ID 458001
Product Type Processor Kit
Processor Type Intel Xeon
Processor Core Quad-Core

1 Year Warranty

KSh 64,999.00

Guaranteed Safe Checkout

Features & Compatibility

HPE DL 380 G7 E5620 PROCESSOR – Intel Xeon E5620 2.40GHz
Key Features
Brand: HPE
Specifications:
Category Proliant Processor
Sub-Category Intel Xeon
Generation G7
Part Number 587476-B21
Products ID 458001
Product Type Processor Kit
Processor Type Intel Xeon
Processor Core Quad-Core

1 Year Warranty

HPE ProLiant DL380 G7 Xeon E5620 Processor Upgrade Kit Review: Legacy Computer

The HPE ProLiant DL380 G7 Intel Xeon E5620 Processor Upgrade Kit delivers reliable quad-core computing power, multi-channel memory scaling, and hardware-level virtualization support. Designed specifically for legacy generation corporate servers, this original equipment manufacturer processor kit allows organizations to maintain or expand their older processing density by installing a secondary CPU, immediately boosting parallel processing thresholds across high-availability network datacenters
Executive Overview and Premium Design Philosophy
The HPE Xeon E5620 processor upgrade kit represents a foundational standard in cost-efficient, stable computing infrastructure for long-standing business operations. It transitions organizational networks from a single-socket system layout to a balanced, dual-processor compute environment. Designed for immediate deployment in legacy virtualization clusters, dedicated storage controllers, and localized file-sharing repositories, this factory-validated hardware solution eliminates application processing bottlenecks without requiring full server overhauls.
Engineered for Elite Professional Workflows
Continuous hardware availability is an absolute requirement for active business file servers, older transaction databases, and staging infrastructure. This processor kit facilitates this necessity by delivering an optimized balance between operating frequency and low thermal thresholds. System administrators can execute steady compute workloads and balance virtual test environments smoothly, ensuring reliable software performance metrics and preventing system transaction lag under standard daily business usage hours.
Structural Integrity and Premium Aesthetics
Featuring a custom-engineered thermal solution, this upgrade kit includes a high-grade performance aluminum or copper heatsink block alongside an array of high-velocity active chassis cooling fans. Unlike generic aftermarket processing units, this genuine factory option kit matches the precise architectural airflow channels of the ProLiant DL380 Generation 7 server housing. The robust mechanical design ensures uniform thermal contact over the processor die surfaces, dissipating heat safely away from the delicate motherboard circuitry and adjacent memory lanes. 
Key Technical Specifications
    • Processor Architecture Model: Intel Xeon E5620 Westmere Generation Quad-Core CPU
    • Total Physical Cores: 4 Processing Cores
    • Total Computational Threads: 8 Concurrent Execution Threads via Hyper-Threading
    • Base Clock Frequency: 2.40 Gigahertz standard operational speed
    • Max Turbo Frequency: 2.66 Gigahertz dynamic acceleration speed
    • Integrated Smart Cache: 12 Megabytes Intel Smart Cache data buffer
    • Thermal Design Power: 80 Watts maximum structural power consumption threshold
    • Memory Sub-System Compatibility: DDR3 Registered ECC running at up to 1066 Megahertz
    • Processor Interconnect Interface: 5.86 Gigatransfers per second Intel QuickPath Interconnect
    • Compatible Server Platform: HPE ProLiant DL380 G7 Rackmount Server Series
    • Compatible Option Kit Configurations: 587476-B21, 587476-L21, and 594883-001 

Top Benefits of the HPE Xeon E5620 Upgrade Kit
Efficient Multi-Threaded Virtualization Optimization
Featuring four physical cores paired with Intel Hyper-Threading technology, this processing core allows you to assign dedicated hardware execution queues to separate guest operating systems. This layout enables smoother background resource scheduling across your computing platform, expanding the total count of operational virtual machines you can run on a single physical machine frame.
Intelligent Thermal Performance Profile Management
Operating inside a tight 80-Watt thermal envelope makes this processor exceptionally cost-efficient to deploy in high-density corporate server installations. Generating less ambient exhaust heat under prolonged processing stresses lowers overall facility air conditioning utility costs while extending the life cycle of close motherboard system components.
Enhanced Memory Sub-System Performance Pipeline
Adding this secondary processing kit activates the remaining hidden memory channels on your server motherboard layout. This expansion effectively doubles your total accessible memory bandwidth, allowing the storage controller to read and write database structures simultaneously across all active DDR3 DIMM channels to accelerate deep application querying paths.
Factory-Validated Drop-In Hardware Integration
Every element inside this option kit package undergoes strict quality control validation to guarantee total operational alignment with ProLiant infrastructure. The embedded processor microcode communicates with the HPE Integrated Lights-Out dashboard out of the box, allowing automatic firmware management updates, temperature monitoring, and hassle-free plug-and-play installation paths.
Server Computational Configuration Comparison

Server CPU Socket Layout Accessible Memory Channels Intel QPI Link Count Primary Workload Capability
Single Processor Mode 3 Active DDR3 Channels 1 Active Interface Link Entry Level File Sharing and Basic Boot Pools
Dual Processor Configuration 6 Active DDR3 Channels 2 Full Interconnect Links Intense Dense Virtualization and Heavy Database Engines

Step-by-Step Server Hardware Installation Instructions
    1. Power Down System Safely: Shut down the server operating system completely, disconnect all active rear AC power cords, and slide the server forward out of the rack rails.
    2. Access the Interior Mainboard: Open the top metallic security access panel and pull the central plastic airflow shroud straight out of the server frame.
    3. Seat the Upgrade Processor: Insert the processing chip into the authorized plastic realignment carrier tool, drop it precisely onto the socket grid pins, and click the retention arms closed.
    4. Mount the Structural Heatsink: Position the performance copper heatsink block cleanly over the processor carrier frame and tighten the retention spring-loaded screws using an alternating cross-pattern script.
    5. Install System Cooling Fans: Slide the high-velocity active cooling fan assemblies from the option kit directly into the corresponding open module paths inside the central fan bracket wall.

Frequently Asked Questions
Can I mix this Xeon E5620 CPU with an older Xeon E5520 model?
No. Multiprocessor configurations require strict structural computing uniformity across both sockets. Attempting to mix processors from different hardware generations or stepping layouts, such as pairing an older Nehalem architecture chip with a newer Westmere generation variant, will cause a motherboard boot halt or a severe processor mismatch error.
What is the specific difference between a B21 and an L21 option kit part suffix?
The alphanumeric suffix code denotes how the hardware bundle is allocated in factory supply channels. A part number ending in B21 represents a standard corporate option upgrade kit intended for retrofitting field servers, whereas an L21 suffix signifies a primary factory-installed processor package shipped out directly inside a fresh custom configuration order.
Does this processor upgrade package include a secondary memory kit?
No. This processing upgrade bundle includes the physical processor chip, the corresponding copper heatsink block, and the required auxiliary high-velocity cooling fan modules. Any additional DDR3 system memory sticks required to populate the secondary memory banks must be ordered as separate component line items.

Additional information