HPE Intel Xeon Silver 4114 2.2 GHz Processor 10-core 13.75 MB Cache

HPE Intel Xeon Silver 4114 2.2 GHz Processor 10-core 13.75 MB Cache
Key Features
Brand: HPE
CPU Manufacturer Intel
CPU Speed 2.2 GHz
CPU Socket LGA 3647
Secondary Cache 13.75 MB

1 Year Warranty

KSh 99,000.00

Guaranteed Safe Checkout

Features & Compatibility

HPE Intel Xeon Silver 4114 2.2 GHz Processor 10-core 13.75 MB Cache
Key Features
Brand: HPE
CPU Manufacturer Intel
CPU Speed 2.2 GHz
CPU Socket LGA 3647
Secondary Cache 13.75 MB

1 Year Warranty

HPE ProLiant Intel Xeon Silver 4114 Processor Upgrade Kit Review: Balanced Computer

The HPE ProLiant Intel Xeon Silver 4114 Processor Upgrade Kit delivers efficient multi-core processing power, expanded system memory bandwidth, and hardware-level virtualization efficiency. Designed specifically for first-generation Intel Scalable server architectures, this original equipment manufacturer upgrade kit allows organizations to expand their computational density by installing a secondary CPU, immediately boosting parallel processing capabilities across high-availability corporate datacenters. 
Executive Overview and Premium Design Philosophy
The HPE Xeon Silver 4114 processor upgrade kit represents a foundational standard in scalable, cost-efficient computing infrastructure for growing business operations. It transitions organizational networks from a single-socket system layout to a highly balanced, dual-processor compute ecosystem. Designed for immediate deployment in data-heavy hypervisor clusters, mid-tier localized databases, and multi-tenant cloud storage platforms, this factory-validated hardware solution eliminates application processing bottlenecks without requiring full server structural overhauls.
Engineered for Elite Professional Workflows
Continuous high-volume computational execution is a foundational necessity for modern business applications, virtual desktops, and shared database systems. The 4114 processor features 10 physical cores running at a balanced clock frequency profile. This design allows system administrators to execute intense concurrent processing loads and scale internal container fleets smoothly, ensuring steady software performance metrics and preventing network transaction lag under peak application usage hours. 
Structural Integrity and Premium Aesthetics
Featuring a custom-engineered thermal solution, this complete upgrade kit includes a high-grade large performance copper heatsink alongside an array of high-velocity active chassis cooling fans. Unlike generic aftermarket processing units, this genuine factory option kit matches the precise architectural airflow channels of your specific ProLiant server housing. The robust mechanical design ensures uniform thermal contact over the processor die surfaces, dissipating heat safely away from the delicate motherboard circuitry and adjacent storage lanes
Key Technical Specifications
    • Processor Architecture Model: Intel Xeon Silver 4114 First Generation Scalable CPU
    • Total Physical Cores: 10 Processing Cores
    • Total Computational Threads: 20 Concurrent Execution Threads via Hyper-Threading
    • Base Clock Frequency: 2.20 Gigahertz standard operational speed
    • Max Turbo Frequency: 3.00 Gigahertz dynamic acceleration speed
    • Integrated Smart Cache: 13.75 Megabytes level-three unified data storage cache
    • Thermal Design Power: 85 Watts maximum structural power consumption threshold
    • Memory Sub-System Compatibility: DDR4 Registered ECC running at up to 2400 Megahertz
    • Maximum System Memory Capacity: Supports up to 768 Gigabytes of volatile RAM per CPU socket
    • Memory Channel Architecture: 6-channel memory architecture per processor
    • Compatible Option Kit Configurations: 826350-B21, 826350-L21, and 873647-B21 (depending on server model) 

Top Benefits of the HPE Xeon-S 4114 Upgrade Kit
Efficient Multi-Threaded Virtualization Core Optimization
Featuring ten physical cores paired with Intel Hyper-Threading technology, this processing core allows you to assign dedicated hardware execution queues to separate guest operating systems. This layout enables smoother background resource scheduling across your computing platform, expanding the total count of operational virtual machines you can run on a single physical machine frame. 
Intelligent Thermal Performance Profile Management
Operating inside a tight 85-Watt thermal envelope makes this processor exceptionally cost-efficient to deploy in high-density corporate server installations. Generating less ambient exhaust heat under prolonged processing stresses lowers overall facility air conditioning utility costs while extending the life cycle of close motherboard system components. 
Enhanced Memory Sub-System Performance Pipeline
Adding this secondary processing kit activates the remaining hidden memory channels on your server motherboard layout. This expansion effectively doubles your total accessible memory bandwidth, allowing the storage controller to read and write database structures simultaneously across all active DDR4 DIMM channels to accelerate deep application querying paths.
Factory-Validated Drop-In Hardware Integration
Every element inside this option kit package undergoes strict quality control validation to guarantee total operational alignment with ProLiant infrastructure. The embedded processor microcode communicates with the HPE Integrated Lights-Out dashboard out of the box, allowing automatic firmware management updates, temperature monitoring, and hassle-free plug-and-play installation paths.
Server Computational Configuration Comparison

Server CPU Socket Layout Accessible Memory Channels Total PCle Lane Paths Primary Workload Capability
Single Processor Mode 6 Active DDR4 Channels 48 High-Speed Lanes Entry Level File Sharing and Basic Boot Pools
Dual Processor Configuration 12 Active DDR4 Channels 96 High-Speed Lanes Intense Dense Virtualization and Heavy Database Engines

Step-by-Step Server Hardware Installation Instructions
    1. Power Down System Safely: Shut down the server operating system completely, disconnect all active rear AC power cords, and slide the server forward out of the rack rails.
    2. Access the Interior Mainboard: Open the top metallic security access panel and pull the clear plastic airflow shroud straight out of the server frame.
    3. Seat the Upgrade Processor: Insert the processing chip into the authorized plastic realignment carrier tool, drop it precisely onto the socket grid pins, and click the retention arms closed.
    4. Mount the Structural Heatsink: Position the high-performance copper heatsink block cleanly over the processor carrier frame and tighten the retention torx screws using an alternating cross-pattern script.
    5. Install System Cooling Fans: Slide the high-velocity active cooling fan assemblies from the option kit directly into the corresponding open module paths inside the central fan bracket wall.

Frequently Asked Questions
Can I mix this first-generation Xeon 4114 with a second-generation Xeon 4210?
No. Multiprocessor configurations require strict structural computing uniformity across both sockets. Attempting to mix processors from different hardware generations, such as pairing a first-generation Scalable chip with a second-generation Scalable Refresh variant, will cause a motherboard boot halt or a severe processor mismatch error. 
What is the specific difference between a B21 and an L21 option kit part suffix?
The alphanumeric suffix code denotes how the hardware bundle is allocated in factory supply channels. A part number ending in B21 represents a standard corporate option upgrade kit intended for retrofitting field servers, whereas an L21 suffix signifies a primary factory-installed processor package shipped out directly inside a fresh custom configuration order.
Does this processor upgrade package include a secondary memory kit?
No. This processing upgrade bundle includes the physical processor chip, the corresponding copper heatsink block, and the required auxiliary high-velocity cooling fan modules. Any additional DDR4 system memory sticks required to populate the secondary memory banks must be ordered as separate component line items.

Additional information