HPE 817927-B21 | HPE DL380 Gen9 Intel Xeon E5-2620v4

HPE 817927-B21 | HPE DL380 Gen9 Intel Xeon E5-2620v4
Key Features
Brand: HPE
HPE ProLiant DL380 Gen9
Intel Xeon E5-2620v4 8-Core (2.10GHz 20MB)
16GB (1 x 16GB) PC4-2400T-R 2400MHz RDIMM 3 x 300GB 12G(10k rpm)
Hot Plug 2.5in Small Form Factor Smart Carrier SAS Smart Array P440ar/2G Module
DVD-RW 500W

1 Year Warranty

KSh 69,500.00

Guaranteed Safe Checkout

Features & Compatibility

HPE 817927-B21 | HPE DL380 Gen9 Intel Xeon E5-2620v4
Key Features
Brand: HPE
HPE ProLiant DL380 Gen9
Intel Xeon E5-2620v4 8-Core (2.10GHz 20MB)
16GB (1 x 16GB) PC4-2400T-R 2400MHz RDIMM 3 x 300GB 12G(10k rpm)
Hot Plug 2.5in Small Form Factor Smart Carrier SAS Smart Array P440ar/2G Module
DVD-RW 500W

1 Year Warranty

HPE ProLiant DL380 Gen9 Intel Xeon E5-2620v4 Processor Upgrade Kit Review: Balanced Computer

The HPE ProLiant DL380 Gen9 Intel Xeon E5-2620v4 Processor Upgrade Kit (817927-B21) delivers optimal multi-core processing power, expanded memory sub-system bandwidth, and hardware-level virtualization efficiency. Designed specifically for eighth-generation and ninth-generation server architectures, this original equipment manufacturer upgrade kit allows organizations to scale their computational density by installing a secondary CPU, immediately boosting parallel processing capabilities across high-availability corporate datacenters.
Executive Overview and Premium Design Philosophy
The HPE 817927-B21 upgrade kit represents an optimized standard in scalable, cost-efficient computing infrastructure for growing business operations. It transitions organizational networks from a single-socket layout to a highly balanced, dual-processor compute ecosystem. Designed for immediate deployment in data-heavy hypervisor clusters, mid-tier localized databases, and multi-tenant cloud storage platforms, this factory-validated hardware solution eliminates application processing bottlenecks without requiring full server structural overhauls.
Engineered for Elite Professional Workflows
Continuous high-volume computational execution is a foundational necessity for modern business applications, virtual desktops, and shared database systems. The Broadwell-EP based E5-2620v4 processor features 8 physical cores running at a balanced clock frequency profile. This design allows system administrators to execute intense concurrent processing loads and scale internal container fleets smoothly, ensuring steady software performance metrics and preventing network transaction lag under peak application usage hours.
Structural Integrity and Premium Aesthetics
Featuring a custom-engineered thermal solution, this complete upgrade kit includes a high-grade large performance copper heatsink alongside an array of high-velocity active chassis cooling fans. Unlike generic aftermarket processing units, this genuine factory option kit matches the precise architectural airflow channels of the ProLiant DL380 Gen9 server housing. The robust mechanical design ensures uniform thermal contact over the processor die surfaces, dissipating heat safely away from the delicate motherboard circuitry and adjacent storage lanes. 
Key Technical Specifications
    • Manufacturer Option Part Number: 817927-B21
    • Processor Architecture Model: Intel Xeon E5-2620v4 Broadwell-EP Generation CPU
    • Total Physical Cores: 8 Processing Cores
    • Total Computational Threads: 16 Concurrent Execution Threads via Hyper-Threading
    • Base Clock Frequency: 2.10 Gigahertz standard operational speed
    • Max Turbo Frequency: 3.00 Gigahertz dynamic acceleration speed
    • Integrated Smart Cache: 20 Megabytes level-three unified data storage cache
    • Thermal Design Power: 85 Watts maximum structural power consumption threshold
    • Memory Sub-System Compatibility: DDR4 Registered ECC running at up to 2133 Megahertz
    • Interconnect Interface Speed: 8.00 Gigatransfers per second Intel QPI Link Speed
    • Compatible Server Platform: HPE ProLiant DL380 Gen9 Rackmount Server Series

Top Benefits of the HPE Xeon E5-2620v4 Upgrade Kit
Efficient Multi-Threaded Virtualization Core Optimization
Featuring eight physical cores paired with Intel Hyper-Threading technology, this processing core allows you to assign dedicated hardware execution queues to separate guest operating systems. This layout enables smoother background resource scheduling across your computing platform, expanding the total count of operational virtual machines you can run on a single physical machine frame.
Intelligent Thermal Performance Profile Management
Operating inside a tight 85-Watt thermal envelope makes this processor exceptionally cost-efficient to deploy in high-density corporate server installations. Generating less ambient exhaust heat under prolonged processing stresses lowers overall facility air conditioning utility costs while extending the life cycle of close motherboard system components.
Enhanced Memory Sub-System Performance Pipeline
Adding this secondary processing kit activates the remaining hidden memory channels on your server motherboard layout. This expansion effectively doubles your total accessible memory bandwidth, allowing the storage controller to read and write database structures simultaneously across all active DDR4 DIMM channels to accelerate deep application querying paths.
Factory-Validated Drop-In Hardware Integration
Every element inside this option kit package undergoes strict quality control validation to guarantee total operational alignment with ProLiant infrastructure. The embedded processor microcode communicates with the HPE Integrated Lights-Out dashboard out of the box, allowing automatic firmware management updates, temperature monitoring, and hassle-free plug-and-play installation paths.
Server Computational Configuration Comparison

Server CPU Socket Layout Accessible Memory Channels Total PCle Lane Paths Primary Workload Capability
Single Processor Mode 4 Active DDR4 Channels 40 High-Speed Lanes Entry Level File Sharing and Basic Boot Pools
Dual Processor Configuration 8 Active DDR4 Channels 80 High-Speed Lanes Intense Dense Virtualization and Heavy Database Engines

Step-by-Step Server Hardware Installation Instructions
    1. Power Down System Safely: Shut down the server operating system completely, disconnect all active rear AC power cords, and slide the server forward out of the rack rails. 
    2. Access the Interior Mainboard: Open the top metallic security access panel and pull the clear plastic airflow shroud straight out of the server frame.
    3. Seat the Upgrade Processor: Insert the processing chip into the authorized plastic realignment carrier tool, drop it precisely onto the socket grid pins, and click the retention arms closed.
    4. Mount the Structural Heatsink: Position the high-performance copper heatsink block cleanly over the processor carrier frame and tighten the retention torx screws using an alternating cross-pattern script.
    5. Install System Cooling Fans: Slide the high-velocity active cooling fan assemblies from the option kit directly into the corresponding open module paths inside the central fan bracket wall.

Frequently Asked Questions
Can I mix this Xeon E5-2620v4 CPU with an older Xeon E5-2620v3 model?
No. Multiprocessor configurations require strict structural computing uniformity and identical hardware stepping layouts to preserve steady computing data paths. Because the v4 model features a 14nm architecture with 8 cores compared to the 22nm 6-core layout of the v3 version, mixing them inside the same server frame will cause a motherboard boot failure. [
What is the specific difference between a B21 and an L21 option kit part suffix?
The alphanumeric suffix code denotes how the hardware bundle is allocated in factory supply channels. A part number ending in B21 represents a standard corporate option upgrade kit intended for retrofitting field servers, whereas an L21 suffix signifies a primary factory-installed processor package shipped out directly inside a fresh custom configuration order.
Does this processor upgrade package include a secondary memory kit?
No. This processing upgrade bundle includes the physical processor chip, the corresponding copper heatsink block, and the required auxiliary high-velocity cooling fan modules. Any additional DDR4 system memory sticks required to populate the secondary memory banks must be ordered as separate component line items.

Additional information